It was a hot mess inside; some toasted components and lots of scorched traces. Some of the previously repaired traces popped right off the board with little to no pressure. On some components, the solder pad was detached and floating freely, barely making contact with the original trace (could push on the component from the other side and see the pad move freely up/down), and likely intermittently detaching from vibrations during play. No telling how many intermittent and/or future issues were laying in wait.
I could see what the repair shop was going for, and this is always a risky and delicate task; but in this case the benefits of preventative maintenance did not really outweigh the risk.
These are just some of the damaged areas -